| MRC | Criteria | Characteristic |
|---|
| AAQL | BODY STYLE | CHIP TYPE |
| AARG | RELIABILITY INDICATOR | ESTABLISHED |
| AARH | RELIABILITY FAILURE RATE LEVEL IN PERCENT | 1.0000 |
| ABJT | TERMINAL LENGTH | 0.010 INCHES NOMINAL |
| ADAQ | BODY LENGTH | 0.055 INCHES NOMINAL |
| ADAT | BODY WIDTH | 0.055 INCHES NOMINAL |
| ADAU | BODY HEIGHT | 0.057 INCHES MAXIMUM |
| AEBP | CENTER TO CENTER DISTANCE BETWEEN TERMINALS PARALLEL TO LENGTH | 0.035 INCHES NOMINAL |
| AEBZ | SCHEMATIC DIAGRAM DESIGNATOR | NO COMMON OR GROUNDED ELECTRODE(S) |
| CQBF | INSULATION RESISTANCE AT MAXIMUM OPERATING TEMP | 100000.0 MEGOHMS |
| CQBQ | CAPACITANCE VALUE PER SECTION | 0.100 PICOFARADS SINGLE SECTION |
| CQJJ | NONDERATED OPERATING TEMP | -55.0 DEG CELSIUS MINIMUM AND 125.0 DEG CELSIUS MAXIMUM |
| CQLZ | TEMP COEFFICIENT OF CAPACITANCE PER SECTION IN PPM PER DEG CELSIUS | 90.0 SINGLE SECTION |
| CQWM | NONDERATED CONTINUOUS VOLTAGE RATING AND TYPE PER SECTION | 50.0 DC SINGLE SECTION |
| CRHD | TOLERANCE OF TEMP COEFFICIENT PER SECTION IN PPM PER DEG CELSIUS | -20.0/20.0 SINGLE SECTION |
| CRTP | TOLERANCE RANGE PER SECTION | -0.10 TO 0.10 PICOFARADS SINGLE SECTION |
| CWJK | CASE MATERIAL | CERAMIC |
| CWPK | INSULATION RESISTANCE AT REFERENCE TEMP | 1000000.0 MEGOHMS |
| CWPM | DISSIPATION FACTOR AT REFERENCE TEMP IN PERCENT | 0.0500 |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| TEST | TEST DATA DOCUMENT | 81349-MIL-C-55681 SPECIFICATION (INCLUDES ENGINEERING TYPE BULLETINS,BROCHURES,ETC.,THAT REFLECT SPECIFICATION TYPE DATA IN SPECIFICATION FORMAT; EXCLUDES COMMERCIAL CATALOGS,INDUSTRY DIRECTORIES,AND SIMILAR TRADE PUBLICATIONS,REFLECTI |
| TTQY | TERMINAL TYPE AND QUANTITY | 2 BONDING PAD |
| ZZZK | SPECIFICATION/STANDARD DATA | 81349-MIL-C-55681/4 GOVERNMENT SPECIFICATION |
