MRC | Criteria | Characteristic |
---|
AAQL | BODY STYLE | CHIP TYPE |
AARG | RELIABILITY INDICATOR | ESTABLISHED |
AARH | RELIABILITY FAILURE RATE LEVEL IN PERCENT | 1.0000 |
ABJT | TERMINAL LENGTH | 0.010 INCHES NOMINAL |
ADAQ | BODY LENGTH | 0.055 INCHES NOMINAL |
ADAT | BODY WIDTH | 0.055 INCHES NOMINAL |
ADAU | BODY HEIGHT | 0.057 INCHES MAXIMUM |
AEBP | CENTER TO CENTER DISTANCE BETWEEN TERMINALS PARALLEL TO LENGTH | 0.035 INCHES NOMINAL |
AEBZ | SCHEMATIC DIAGRAM DESIGNATOR | NO COMMON OR GROUNDED ELECTRODE(S) |
CQBF | INSULATION RESISTANCE AT MAXIMUM OPERATING TEMP | 100000.0 MEGOHMS |
CQBQ | CAPACITANCE VALUE PER SECTION | 0.100 PICOFARADS SINGLE SECTION |
CQJJ | NONDERATED OPERATING TEMP | -55.0 DEG CELSIUS MINIMUM AND 125.0 DEG CELSIUS MAXIMUM |
CQLZ | TEMP COEFFICIENT OF CAPACITANCE PER SECTION IN PPM PER DEG CELSIUS | 90.0 SINGLE SECTION |
CQWM | NONDERATED CONTINUOUS VOLTAGE RATING AND TYPE PER SECTION | 50.0 DC SINGLE SECTION |
CRHD | TOLERANCE OF TEMP COEFFICIENT PER SECTION IN PPM PER DEG CELSIUS | -20.0/20.0 SINGLE SECTION |
CRTP | TOLERANCE RANGE PER SECTION | -0.10 TO 0.10 PICOFARADS SINGLE SECTION |
CWJK | CASE MATERIAL | CERAMIC |
CWPK | INSULATION RESISTANCE AT REFERENCE TEMP | 1000000.0 MEGOHMS |
CWPM | DISSIPATION FACTOR AT REFERENCE TEMP IN PERCENT | 0.0500 |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
TEST | TEST DATA DOCUMENT | 81349-MIL-C-55681 SPECIFICATION (INCLUDES ENGINEERING TYPE BULLETINS,BROCHURES,ETC.,THAT REFLECT SPECIFICATION TYPE DATA IN SPECIFICATION FORMAT; EXCLUDES COMMERCIAL CATALOGS,INDUSTRY DIRECTORIES,AND SIMILAR TRADE PUBLICATIONS,REFLECTI |
TTQY | TERMINAL TYPE AND QUANTITY | 2 BONDING PAD |
ZZZK | SPECIFICATION/STANDARD DATA | 81349-MIL-C-55681/4 GOVERNMENT SPECIFICATION |